Topology

The primary engineering goal of the project is to continue to build on a long history of technical collaboration between Asia Pacific network operators and Indiana University to provide next-generation, highly functional, flexible, and reliable connectivity between Asia and US research and education networks. This connectivity will provide researchers in a wide range of science disciplines access to high bandwidth network paths for data sharing. TransPAC continues to work with the APR (Asia-Pacific Ring) collaboration to provide resilient connectivity in the region through mutual backups.

Currently TransPAC has 3 circuits:

• TransPAC - Pacific Wave 100G circuit between the Pacfic Northwest Gigapop in Seattle, WA and APAN in Tokyo, Japan.
• Two 10G Circuits between GOREX in Guam and the Mega-I building in Hong Kong.